生长方式/Growth

CZ，MCZ，FZ

等级/Grade

Prime，Test,Dummy，etc.

直径/Diameter

4inch / 100mm  (1 inch – 12 inch / 25.4mm – 300mm)

厚度/Thickness

50-5000um，etc.

表面状态/Finish

As cut，lapped，eached，etc.

晶向/orientation

（100）（111）（110）（211）（311）（511）(531)，etc.

晶向偏角/Off cut

up to 7deg

掺杂类型/Type/Dopant

P/B,N/Phos，N/Sb，N/As，Intrinsic

电阻率/Resistivity

CZ/MCZ:  From 0.001 to  100 ohm.cm

FZ:      From 100 to >20000 ohm.cm

薄膜/Thin films

PVD:Al、Ni、Cu、Ti、Ag、Au、Pt、Fe、Mo，etc.                    Coating thickness: up to 3000nm±5%

LPCVD/PECVD:Oxide、Nitride、TEOS、LTO、SIPOS、SiC、POLY、etc.   Coating thickness: up to 3000nm±3%

Thermal oxidation: Oxide                                      Coating thickness: 5nm to 10000nm±1%

Silicon epitaxial wafers and epitaxial services （SOS、GOI、SOI、GaN、GaAs、InP,etc.)

加工服务/Processes

定制单双抛、超薄、超厚、超平硅片、切割不同尺寸、不同形状，打孔硅片；/SSP,DSP,ultra thin，ultra flat，etc.

打孔、掏圆、切割、减薄/ Punch、Downsizing、dicing、back grinding，etc.

微纳加工/MEMS